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At DSi, we understand the intricate world of Integrated Circuit (IC) packaging and how it plays a crucial role in safeguarding the heart of your electronic devices. Our IC packaging services go beyond the conventional - we're here to ensure your innovations shine.
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We believe in thoroughness and precision at each stage of our package flow, ensuring your semiconductor devices are handled with care and expertise
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Silicon Initiation Assistance
Kickstart your journey with our expert guidance and support.
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Package Feasibility
Assess project feasibility, considering size, cost, and materials.
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Package Design
Craft precise and creative packaging solutions tailored to your needs.
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Package Release
Ensure a seamless transition with finalized documentation and requirements
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Engineering Build
Meticulously construct packaging solutions with attention to detail.
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Verification
Guarantee top-tier quality through rigorous testing and analysis.
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Production
From prototype to mass production, we deliver excellence.
At DSi, we ensure IC packaging integrity through rigorous design verification and comprehensive analysis.
- We kick off our process with Sales/PM briefings to gain a deep understanding of your product.
- Customers and back-end teams submit Package Request Forms, providing essential project details and requirements.
- Expertise guides us in choosing the right package type, size, and stack-up.
- We consider cost implications, identify primary/secondary suppliers, and ensure all necessary tooling and materials are ready.
- At the Kickoff stage, we confirm the completeness of project specifications.
- We identify any required extractions/simulations and set expectations for design checkpoints.
- Design rules are meticulously identified to ensure precision.
- Critical IP undergoes a full review, and simulations, including thermal and mechanical aspects, are performed.
- Our team ensures chip lead and relevant block owners approve the design.
- We complete vital documentation such as the Package Checklist, MOD for datasheets, and POD for socket integration.
- Supplier documentation is finalized, and we attend pre-Tape out meetings to ensure everything is in place.
- Initial substrates are ordered, with clear communication about quantity and delivery schedules.
- We confirm the availability of all necessary tooling and materials, releasing assembly instructions before wafer arrival at the factory.
- We allocate materials for qualification and coordinate the build.
- Qualification reports are obtained, and we collaborate with Product Engineering for testing.
- Any necessary follow-ups or corrective actions are addressed, and our records are updated.
- With confidence in package quality, we transition to Production.
- We complete optimization and pre-production processes, ensuring seamless material management under the care of our Planning team.
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USA Office
8201 164th Ave NE, Suite 200
Redmond WA 98052
United States of America
+1 (404) 287-0730
Bangladesh Office
House 177, Lane 2, New DOHS
Mohakhali, Dhaka 1206
Bangladesh
+88 02222287041
+88017300-374-00
European Liaison Office
32 Swansea Court
London
E16 2RT
United Kingdom
+44 7850 051037